Hewlett Packard Hp 825 Desktop Computer Processor D5061-3001 for sale in Roseville, CA
HEWLETT PACKARD HP 9825 DESKTOP COMPUTER PROCESSOR D5061-3001 1984 NOTE: THE ADDITIONAL PICTURES ARE REPRESENTATIVE OF THE ROM INTERNALS. HP had looked at process technology and in the early 1970's select NMOS over PMOS. NMOS had greater potential, albeit trickier to make at the time. In 1973 HP began using their second generation NMOS process, a shrink to 5 microns from the original 7 microns. Even at 5 microns the 16-bit design of the 5061-30xx took multiple dies, all bonded on one package, to implement. The final result was a single ceramic package containing 3 dies: a BPC (Binary Processor Chip) that executed 57 instructions, an EMC Extended Math Chip, which handled 15 floating point type math instructions, and the IOC, an I/O chip which implemented 12 I/O instructions. A later version (the D5061-3001) would add a 4th chip to the package called the AEC, Address Extension chip, allowing this 1970's design to address up to 4GB of memory. THE CERAMIC SUBSTRATE IS ATTACHED TO A METAL HEAT SINK WITH THERMAL COMPOUND. THE SUBSTRATE HAS GOLD TRACES AND THE DIE IS BONDED WITH GOLD WIRE TO THE SUBSTRATE.
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